報告專家：Guangming Zhang

報告時間：2025年9月1日10:30

報告地點：雁塔校區機械學院210會議室

專家簡介：Prof. Guangming Zhang has contributed to key developments in the fields of reliability testing and failure analysis of modern microelectronic packages, ultrasonic signal/image processing, acoustic micro-imaging, and acoustic modelling through innovative fundamental research and major government and industrial collaborative research contracts. His research in ultrasonic signal processing and reliability testing of microelectronic packages has led on the development of super resolution acoustic time-frequency domain imaging techniques for three-dimensional (3D) evaluation and through-life non-destructive monitoring of next generation microelectronic packages and systems. This has been recognised internationally by industries and academia in the fields of modern 3D microelectronic package inspection and scanning acoustic microscopy (SAM). For example, Fraunhofer Institute for Reliability and Microintegration IZM, one of the world’s leading institutes for applied research and the development and system integration of robust and reliable electronics, approached us to inspect 3D embedded chips using our techniques. Some of these techniques have been transferred into Sonoscan which is a major scanning acoustic microscopy manufacturer, and Delphi electronics and safety, through two technology transfer projects funded by EU TETRACOM grants in 2015 and 2016 respectively. Advanced research in ultrasonic signal processing plus the integration of a signal processing toolbox for 3D acoustic micro imaging (AMI) has added a new dimension to 2D scanning acoustic microscopes. The technology transfer project '3DAP-TIME’ has enabled Sonoscan to investigate novel 3D image processing to find ‘hidden’ details in acoustic micro-imaging scans. Recently the developed techniques have been extended to investigate the reliability of novel nano-geopolymer ceramic reinforced SnCu solders in partnership with Universiti Malaysia Perlis, Malaysia, through Newton Fund Institution Links funding. Most recently, the developed techniques have led to a H2020-MSCA-RISE-2019 grant award to study ‘Reliable Electronics for Tomorrow’s Active Systems’.

主辦單位：發展規劃與學科建設處

承辦單位：機械工程學院